Visit Evonik at booth J48 to learn more about the following:
ROHACELL® EC electrically conductive foam for composite cores with superior dielectric properties.
ROHACELL® Foam Core
ROHACELL® Foam Core for lightweight sandwich design components.
COMPIMIDE® 50LM low melting bismaleimide resin for liquid processing.
High performance bismaleimide resins
High performance bismaleimide resins for advanced composites.
High performance epoxy composite solutions
High performance epoxy composite solutions for low viscosity and enhanced toughness.
Evonik will be exhibiting at several tradeshows in 2019.
We hope to see you there!